SPI_Layout_Guide_AN(7)

针对高速SPI FLASH的PCB走线规则。

Application

Note

Figure 4.5 FAB024 and ZSA024 Proposed Land Pattern

Figure 4.6 FAC024 Proposed Land Pattern

4.1BGA Land Pad Recommendations

PCB solder-ball land pads can be either non-solder-mask defined (NSMD) or solder-mask-defined (SMD). For NSMD configurations, there is a small gap between the solder pad and the solder mask. Solder will flow into the gap between the pad and the solder mask (reference Figure4.7). For SMD configurations, the solder mask covers the outer edge of the solder pad. Solder is prevented from flowing over the edges of the pad by

the solder mask.