DAC8501_芯片手册(2)

DAC 芯片~ 16位超级好用,不容错过

ABSOLUTE MAXIMUM RATINGS(1)

VDD to GND...........................................................................–0.3V to +6VDigital Input Voltage to GND.................................–0.3V to +VDD + 0.3VVOUT to GND..........................................................–0.3V to +VDD + 0.3VVREF to GND...........................................................–0.3V to +VDD + 0.3VVFB to GND.............................................................–0.3V to +VDD + 0.3VOperating Temperature Range......................................–40°C to +105°CStorage Temperature Range.........................................–65°C to +150°CJunction Temperature Range (TJ max)........................................+150°CPower Dissipation........................................................(TJ max — TA)/θJA

θJA Thermal Impedance.........................................................206°C/WθJC Thermal Impedance...........................................................44°C/WLead Temperature, Soldering:

Vapor Phase (60s)...............................................................+215°CInfrared (15s)........................................................................+220°CNOTE: (1) Stresses above those listed under Absolute Maximum Ratings maycause permanent damage to the device. Exposure to absolute maximumconditions for extended periods may affect device reliability.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-ments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handlingand installation procedures can cause damage.

ESD damage can range from subtle performance degradationto complete device failure. Precision integrated circuits may bemore susceptible to damage because very small parametricchanges could cause the device not to meet its publishedspecifications.

PACKAGE/ORDERING INFORMATION

RELATIVEACCURACY(LSB)

±64

DIFFERENTIALNONLINEARITY

(LSB)

±1

PACKAGE

PACKAGE-LEADDESIGNATOR(1)

MSOP-8

SPECIFICATIONTEMPERATURE

RANGE–40°C to +105°C

PACKAGEMARKINGD01

ORDERINGNUMBERDAC8501E/250DAC8501E/2K5

TRANSPORTMEDIA, QUANTITYTape and Reel, 250Tape and Reel, 2500

PRODUCTDAC8501E

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DGK

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NOTE: (1) For the most current specifications and package information, refer to our web site at .

PIN CONFIGURATIONS

Top View

MSOP

PIN DESCRIPTION

PIN1234

NAMEVDDVREFVFBVOUTSYNC

DESCRIPTION

Power-Supply Input, +2.7V to +5.5VReference Voltage Input

Feedback connection for the output amplifier.Analog output voltage from DAC. The output ampli-

fier has rail-to-rail operation.

Level-triggered control input (active LOW). This isthe frame synchronization signal for the input data.When SYNC goes LOW, it enables the input shiftregister and data is transferred in on the fallingedges of the following clocks. The DAC is updatedHIGH before this edge, in which case the risingsequence is ignored by the DAC8501.

Serial Clock Input. Data can be transferred at ratesup to 30MHz.

Serial Data Input. Data is clocked into the 24-bitinput shift register on the falling edge of the serialclock input.

Ground reference point for all circuitry on the part.

VDDVREF VFB VOUT

12

DAC8501

34

8765

GNDDINSCLKSYNC

5

67

SCLKDIN

8GND

2

DAC8501

SBAS212A